Datacon 2200 evo manual « » 1-3. The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip. Datacon 2200 evo manual « » 1-3. The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip.

Packaging Besi's Packaging product group designs, develops and manufactures molding, trim & form and singulation systems under the Fico brand name. The reliable systems can process a wide variety of packages. Automatic as well as manual systems use the same molds or tools. Therefore, your process can be optimized without interfering in your production capacity. Flora Of Pakistan Pdf. All systems offer a low cost of ownership and since no customer uses a standard product, any configuration of the machinery can be created, dedicated to your needs. Besi Netherlands creates exceptional customer value by offering ultimate reliability and productivity, excellent customer service, extreme precision and high production yields.

The flexibility of the systems permits both high volume production of devices and small production runs of specialized chips. At the same time the sophisticated features of the equipment enable it to support the introduction of new packages. Besi Netherlands is headquartered in Duiven (the Netherlands), and operates service centers in Europe, Asia and the USA.

2200 evo -2200 evo plus. Datacon Datacon Fico Meco Fico New 8. •Besi has full range of AP systems. 2014E revenue. Datacon 2200 evo manual comes, Telecharger user agent switcher, The golden book of melchizedek pdf.

CAPABILITY: JEDEC tray input/output Accuracy +/- 10 µm @ 3 sigma, cpk 1.33 Theta axis rotary bond head 0˚ to 360˚ increments 0.0045˚ Theta placement accuracy +/- 0.15˚ @ 3 sigma Automatic calibration function corrects thermal changes over time Multi-chip placement in one single pass capability Picking from wafer ( 4 to 12 in.) on 12 in. Frame (Or waffle pack / GEL PAK ( 2 x 2 in.) Wafer table with stretcher 7 positions automatic tool changer unit SECs/GEM capability Wafer scanner and electronic wafer mapping capable Pattern recognition system with edge, gray level, pattern and ink dot Wafer size 50 to 300 mm Frame size 375 mm Die size 0.5 mm to 50 mm Die thickness 0. Intel 802.11 B G N Wlan Driver. 05 to 7 mm.